EVALUATION OF SILICON ON INSULATOR (SOI) BONDED WAFERS USING AUTOMATED ACOUSTIC MICRO IMAGINGAuthors: Janet E. Semmens and Bryan P. Schackmuth
Company: Sonoscan, Inc.
Date Published: 2/13/2001 Conference: Pan Pacific Symposium
This paper will present a discussion of acoustic micro imaging as it applies to the analysis of SOI bonding and show how methods to avoid contamination of the wafers and automatic parts handling can be integrated into the inspection method to provide for rapid inspection rates of the wafers.
Key Words: SOI, Wafer bonding, Acoustic Micro Imaging
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