Pan Pacific Symposium Conference Proceedings


EVALUATION OF SILICON ON INSULATOR (SOI) BONDED WAFERS USING AUTOMATED ACOUSTIC MICRO IMAGING

Authors: Janet E. Semmens and Bryan P. Schackmuth
Company: Sonoscan, Inc.
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Abstract: There is increasing use of Silicon on Insulator (SOI) in the manufacture of integrated circuits due to advantages in speed and power (high speed/low power requirements) in the devices. In the process of manufacturing the SOI bonding defects can occur. Acoustic micro imaging has become an established laboratory method for defect detection in SOI bonds. Now, with the increase in demand there is a need to increase the rate at which the wafers can be inspected. Techniques have been incorporated for automated parts handling and computer image analysis to allow for inspection at a more rapid rate. Recent advancements in resolution, automated parts handling, and in image analysis software have been combined to significantly advance the application into the realm of practicality outside of the lab.

This paper will present a discussion of acoustic micro imaging as it applies to the analysis of SOI bonding and show how methods to avoid contamination of the wafers and automatic parts handling can be integrated into the inspection method to provide for rapid inspection rates of the wafers.

Key Words: SOI, Wafer bonding, Acoustic Micro Imaging



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