Pan Pacific Symposium Conference Proceedings


DESIGN AND ASSEMBLY FACTORS FOR 0201 COMPONENTS

Author: Christina Piasky
Company: IBM Corporation
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Abstract: IBM Numa-Q designed and assembled twelve test vehicle boards, each containing 1400 0201 resistor packages. The boards were assembled in a production environment at the Celestica Toronto facility in April of 2000. The research summarized in this paper will address issues surrounding the design of printed circuit boards and assembly of 0201 components. Board construction, pad patterns, via in pad, component spacings, and component selection will be discussed. From an assembly view point, 0201 components result in unique challenges. This paper will address challenges in assembly including: stencil design, paste screening, pick-n-place equipment, reflow profiling, and a summary of defects.

Key Words: 0201, board design, via-in-pad, tombstoning



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