SMTA International Conference Proceedings


Author: Paul Sperry
Company: GET Manufacturing
Date Published: 9/12/1999   Conference: SMTA International

Abstract: The explosion of BGA packaging and assembly processes have given rise to the need for manufacturing process qualification. Contrasting to other technologies, BGA requires precise control over several key SMT processes. Of those processes; paste printing, and soldering are paramount. If a manufacturing operation needs or wants to be successful with BGA products, process qualification must take place. Engineering process development and qualification must be conducted before the process is at a production ready state. While it is true that the BGA components will “self align” in the soldering oven, other latent defects, such as voids, will affect the performance and reliability of the product over the long haul. Electronic Manufacturing Service companies can no longer avoid developing process capability. Since BGA technology requires the Contract Manufacturer to “do it right the first time”, manufacturers are scrambling to qualify the processes dictated by the advanced packaging. To successfully qualify BGA products into the contractor’s capability, testing and evaluation must be conducted. To develop a robust process, the manufacturer must optimize the equipment settings and processes in the SMT area. One of the largest defects found on BGA packages are solder voids due to poor process set-up and control. The following sections will demonstrate how to qualify BGA assembly processes on a relatively low budget.

Key words; Ball Grid array, process qualification,

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