THE NEO-MANHATTAN BUMP INTERCONNECTION FOR B²IT BUILD-UP PRINTED WIRING BOARDS AND AREA ARRAY IC PACKAGE SUBSTRATES
Author: Kenji Ohsawa Company: North Corporation Date Published: 2/13/2001
Pan Pacific Symposium
Abstract: The electronic systems of today, particularly in the mobile consumer and home PC markets, require higher density sub-components that are smaller in size and greater in functionality than their predecessors. Build-up PWB technologies developed and commercialized during the last decade have been an important enabler for high-density main system boards and substrates for area array IC packaging. However, the existing build-up technologies are beginning to face bottlenecks in their ability to meet the increasingly complex technical demands being driven by miniaturization and densification of electronic product applications. In response to this market demand, an, etched copper bump on copper foil substrate technology has been developed that is complementary and will enable build-up PWBs to successfully meet future technology needs.