Pan Pacific Symposium Conference Proceedings


THE NEO-MANHATTAN BUMP INTERCONNECTION FOR B²IT BUILD-UP PRINTED WIRING BOARDS AND AREA ARRAY IC PACKAGE SUBSTRATES

Author: Kenji Ohsawa
Company: North Corporation
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Abstract: The electronic systems of today, particularly in the mobile consumer and home PC markets, require higher density sub-components that are smaller in size and greater in functionality than their predecessors. Build-up PWB technologies developed and commercialized during the last decade have been an important enabler for high-density main system boards and substrates for area array IC packaging. However, the existing build-up technologies are beginning to face bottlenecks in their ability to meet the increasingly complex technical demands being driven by miniaturization and densification of electronic product applications. In response to this market demand, an, etched copper bump on copper foil substrate technology has been developed that is complementary and will enable build-up PWBs to successfully meet future technology needs.

Keywords: Build-up, Substrate, BGA, CSP,



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819