Pan Pacific Symposium Conference Proceedings


Author: Dale Lee
Company: Manufacturers' Services Ltd.
Date Published: 2/13/2001   Conference: Pan Pacific Symposium

Abstract: With the WEEE Directive Proposal in Europe and Recycling Act in Japan, legislation is in place for the limited use or elimination of lead in electronic assemblies. Many corporations, industry associations, government agencies and academic institutions have active programs to evaluate alternative materials and processes for impacts on product manufacturability, quality, reliability and cost. However, very few studies have evaluated the impacts of leadfree solder process upon follow-on processes such as test and final product assembly.

As part of a joint technology development project, Iomega and Manufacturers’ Services Ltd. has begun work on a multi-phase implementation plan that would allow for a smooth transition from traditional lead containing materials and assembly processes to leadfree. As part of this study was an impact evaluation of leadfree solder on the total assembly process from printed circuit board assembly (PCBA) through final product assembly. This paper will present the results of the leadfree PCB finish evaluation phase for implementation of surface mount leadfree assembly on removable media computer disk drives.

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