Pan Pacific Symposium Conference Proceedings


ADVANCED WAFER LEVEL CSP PACKAGING USING NEW LIQUID BISMALEIMIDE POLYMERS

Authors: T. Wakabayashi, O. Kuwabara
Company: IEP Technologies, Inc.
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Abstract: The general interconnection technologies between the chips and the substrates currently being very popular for semiconductors are COB, BGA, Flip chip, etc., using wirebonding and also flip chip bump bondings through the help of interposers made of laminate, ceramics and also tapes. This conventional technology has been prevailing for the past several years. On the other hand, this new wafer level CSP package approach using novel liquid bismaleimide polymers can exhibit many technical advantages over the past packaging technologies. It will not require the use of interposers, as it will be directly mounted onto the mother board, and also will help to meet the continued demand for package miniaturization.

Key words: COB-Chip on Board, BGA-Ball Grid Array, Flip chip, bumps, CSP -Chip Size Package



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