Pan Pacific Symposium Conference Proceedings


LIQUID CRYSTAL POLYMER FILM WITH HIGH HEAT RESISTANCE AND HIGH DIMENTIONAL STABILITY

Authors: Hiroshi Inoue, Sunao Fukutake, Hiroyuki Ohata
Company: JAPAN GORE-TEX INC.
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Seika Machinery, Inc.

Abstract: We remarked all-aromatic polyester, which is one of super engineering plastics, in that it can be used as base material of electronic circuit for its environmental compatibility, moisture resistance, dimensional stability and heat resistance. As Type-I all-aromatic polyester has the highest heat resistance among all 3 types of aromatic polyesters, we succeeded in making it into a film material with highly controlled orientation. This liquid crystal polymer film, BIAC®, has solder heat resistance up to 280C and high dimensional stability. Its Coefficient of Hygroscopic Expansion is 1.5 ppm/% and Coefficient of Thermal Expansion is controllable and stable in a wide range of temperature. Furthermore, its most remarkable property is its water absorption of 0.1%, which is approximately 1/10 of that of polyimide film.

Key words: LCP, FPC, TAB, T-BGA, CSP, COF



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