PRODUCT DEVELOPMENT AND IMPLEMENTATION OF A SELF–FLUXING UNDERFILL (FluxFill) INTO WIRELESS COMMUNICATION PRODUCTS
Authors: Bryan Anderson Company: Dexter Electronic Materials Date Published: 2/13/2001
Pan Pacific Symposium
Abstract: The benefits of a self-fluxing underfill (SFU) encapsulant for direct chip attach (DCA) include both manufacturing cost and product quality improvements. There are two key technology challenges that must be met before a self-fluxing underfill encapsulant can be selected and implemented. Those key elements include factory environment yield and product level reliability. Material formulation hurdles including fluxing and catalyst activity have been overcome during this multi-year joint development effort. The various studies will be summarized including the impact of multiple formulations on factory environment assembly yield and end product reliability.
Keywords: Underfill, Self-Fluxing, Flip Chip, and No-Flow.