Pan Pacific Symposium Conference Proceedings


ADVANCED IC PACKAGING DESIGN OPTIMIZATION

Author: Les Ammann
Company: Zuken USA Incorporated
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Abstract: One way EDA companies are thinking ahead in packaging automation is by supplying program interaction between the designer for 2D and 3D design environments. This new design approach offers automated functionality to fully support build-up design technology with 3D-pattern viewing, giving designers a virtual-reality design sense.



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