INERTING THE WAVE SOLDERING PROCESS WITH MEMBRANE-GENERATED NITROGENAuthor: Chrys Shea
Date Published: 9/12/1999 Conference: SMTA International
Research is now beginning on the application of lower purity nitrogen in the wave soldering environment. The successful application of lower purity nitrogen can reduce the total cost of ownership of an inerted wave process, and, therefore, make it more affordable and available to a broader base of electronics assemblers. The focus of this study is on the application of membrane-generated nitrogen, with typical residual oxygen levels (ROL’s) of 1000 to 30,000 ppm. Preliminary studies indicate a high degree of compatibility with the wave soldering process, particularly in machines fitted with hot nitrogen knives.
The study described in this paper was performed in a production environment at Siemens Information and Communications Networks in Cherry Hill, New Jersey, and originally published at Nepcon West ’99.
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