ADHESION OF FLIP-CHIP UNDERFILLS TO VARIOUS DIE PASSIVATIONS BEFORE AND AFTER ACCELERATED ENVIREMENTAL EXPOSUREAuthors: Mark Dimke, Ph.D.
Company: Dexter Electronic Materials
Date Published: 2/13/2001 Conference: Pan Pacific Symposium
This study evaluates adhesion between the flip-chip underfill and the passivation utilizing a die shear methodology. The test vehicle utilized for this study is a 100-mil square peripherally bumped die provided by Flipchip Technologies. The die are identical with the exception of the three passivations being examined. Six different underfills were evaluated for adhesion after the listed environmental exposures; initial, JEDEC 3 utilizing a 260° C reflow, JEDEC 3 plus 24 Hr. Pressure Cooker Testing (PCT), JEDEC 3 plus 96 Hr. PCT, JEDEC 3 plus 168 Hr. PCT and JEDEC 3 plus 1000 cycles condition B.
Results of the study will demonstrate passivation/underfill combinations that have good adhesion through environmental exposure. The use of this data will allow packaging engineers to more judicially choose the materials sets for the flip-chip packages and reduce the number of trials required for qualifications. In addition, this study will chronicle the evolution of adhesion in underfill materials.
Key words: Flip-chip, underfills, passivation
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