SMTA International Conference Proceedings


HIGH-SPEED SECOND - LEVEL CSP AND FLIP CHIP ASSEMBLY USING FLIP CHIP SHOOTERS

Author: Günter Schiebel
Company: Siemens AG
Date Published: 9/12/1999   Conference: SMTA International


Abstract: The advanced packages BGA, CSP and flip chip will to a continuously increasing degree incorporated in future SMT board designs. Currently micro BGAs/CSPs (Chip Size/Scale Packages) with a minimum ball pitch of 0.5 mm and a ball diameter of 0.25 - 0.3 mm are attracting more and more interest.

Due to the strongly growing consumption figures of all these packages, particularly in the automotive, telecommunication, computer, watches and smart card/RFID applications, throughput is becoming more and more an issue. In the areas low cost watches RFIDs which mostly are pure flip chip applications the market already demands flip chip shooters! This paper gives a brief overview of some applications, where high-speed mounting or even processing of advanced packages is required. The paper addresses as well the various criteria for achieving high throughputs with area array packages and bare dies for COB using advanced chip shooters.

The key criteria are the machine concept, component feeding, type of flux and adhesive application, component vision technique and PCB vision technique.

Key words: Smart Card, RFID, Flip Chip Shooter, dip fluxing, no-flow underfill



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