Emerging Technologies Conference Proceedings


CONSIDERATIONS FOR THE PIN PROBE TESTING OF NO-CLEAN SOLDER PASTE RESIDUES

Author: David Suraski
Company: AIM
Date Published: 11/1/2000   Conference: Emerging Technologies


Abstract: In theory, all solder pastes are pin probe testable. However, very few pastes possess the broad process window that allows them to perform successfully under a wide-variety of pin testing methods. Furthermore, many solder pastes marketed as “pin probeable” leave residues with marginal insulation characteristics that can result in poor long-term reliability. In addition to paste chemistry, the pin probe testability of a solder paste is directly dependent upon several process factors. The most important of these factors are length of time between reflow and testing and the type and number of reflow profiles to which the paste is exposed. Other factors include the type of probes utilized, the spring forces, and the type of parts being probed. This paper shall address the difficulties that may be encountered during the pin probe testing of no-clean solder paste residues and will discuss the means by which many of the difficulties currently associated with can be eliminated. These methods of simplifying the pin probe testing process will address solder paste requirements as well as pin probing materials and process considerations.

Keywords: Pin Probe Testing, No-Clean, Solder Paste, Residue, Spring Force, Reliability.



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