CIRCUIT CARD ASSEMBLY PRODUCT DEVELOPMENT FOR HIGH DENSITY ELECTRONIC PACKAGING
Author: Michael G. Luke Company: Raytheon Electronic Systems Date Published: 11/1/2000
Abstract: Development of circuit card assemblies (CCA) for high density electronic packaging involves several processes starting from conceptual design through component assembly and test. Component technology has driven the design layout, fabrication, assembly and test functions to new levels of complexity and difficulty. The process to develop a new CCA product for prototype evaluation is often difficult to manage and control resulting in product that is late or does not meet requirements. A process specifically designed to coordinate all areas involved in circuit card assembly prototype development has proven to be effective resulting in improved designs, reduced cycle time and conformance to requirements for prototype and small volume production. The focal point of this process is the Product Development Engineer (PDE) who has responsibility for both technical issues and facilitation of the CCA development. In this paper, the overall process is discussed and the six major elements highlighted. Specific tasks and deliverables are identified that are necessary for success in each element. Design for manufacturability is discussed and covers key items for each area in circuit card fabrication, assembly and test. Toolsets which may be used by the PDE to provide technical input for design are highlighted. Data for the product development activity is contained in a master database maintained by the PDE and available to all involved in the process. Metrics are easily attainable from the database for tracking specific programs or evaluating the overall trends in the CCA product development process. The exact process and tools discussed in this paper are not offered for use by other companies but rather it can be used as a model for developing a process that is similar and tailored for other organizations involved in CCA product development.