SELECTIVE SOLDERING WITH LASER OR MINI-WAVEAuthor: Armin Rahn
Company: SEHO consultant
Date Published: 9/12/1999 Conference: SMTA International
We will concentrate on two such selective processes: Laser soldering and mini-wave soldering. With the event of powerful diode lasers, laser soldering has become very alluring and cost effective. Known as the soldering method that can produce the most reliable joints, it exerts a minimum of stress on the surrounding area. Laser soldering is fast and offers a large amount of options: e.g. split beams and bars of light can be produced to simultaneously solder several joints. Allied with the proper robotic handling systems, laser soldering may be employed as stand-alone or an in-line equipment.
Mini-wave soldering has been known as a de-soldering tool for a long time. This system has matured and has become more sophisticated. New wave designs, wave-height control, several nitrogen options and pin-point accuracy makes mini-wave soldering a viable alternative. Dip versions as well as 'drag over the wave' are available and several arrangements have been designed: indexing rotary tables, in-line equipment and stand-alone units. The talk will conclude with a depiction of an actual in-line operation making use of reflow for SM and Laser as well as mini-wave technology for selective soldering.
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