SMTA International Conference Proceedings


PROCESS CONTROL FOR SOLDER PASTE DEPOSITION

Author: Mark Owen
Company: MV Technology
Date Published: 9/12/1999   Conference: SMTA International


Abstract: A review of solder paste inspection, including the motivation for inspecting solder paste, the sensor technologies used to acquire 2D/3D inspection and measurement data, methods of using measurement data to identify problems and appropriate corrective actions, and guidance on developing an AOI strategy that matches product technology, throughput, and mix.



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