TEST AND INSPECTION AS PART OF PROCESS CONTROLAuthor: Stig Oresjo
Company: Hewlett-Packard Company
Date Published: 9/12/1999 Conference: SMTA International
This paper will present significant data gathered from real production of several major Printed Circuit Board Assembly (PCBA) manufacturers, including Contract Manufacturers. The data will show which component types and package types have the most defects. The paper will answer questions such as: Do BGA’s have a significantly lower defect level than other components? How big a part of the fault spectrum is coming from chip resistors and chip capacitors? Which components in this data sample have the highest defect levels?
The paper will also briefly discuss improvements in long term reliability if certain types of faults are identified and removed.
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