SMTA International Conference Proceedings


Author: Stig Oresjo
Company: Hewlett-Packard Company
Date Published: 9/12/1999   Conference: SMTA International

Abstract: The first step in using test and inspection as a process control tool is to select highly-effective test and inspection methods for the most common faults in the process. If the test and inspection systems can not detect the failures, then there will be very little information for the process control. Also of importance is to filter out false calls before data is collected and used for process control. If not, incorrect data for process control will be used.

This paper will present significant data gathered from real production of several major Printed Circuit Board Assembly (PCBA) manufacturers, including Contract Manufacturers. The data will show which component types and package types have the most defects. The paper will answer questions such as: Do BGA’s have a significantly lower defect level than other components? How big a part of the fault spectrum is coming from chip resistors and chip capacitors? Which components in this data sample have the highest defect levels?

The paper will also briefly discuss improvements in long term reliability if certain types of faults are identified and removed.

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