Evaluation of Direct Metallization Technology Plating Properties with Excellent Material SelectivityAuthors: Takuya Komeda, Tetsuji Ishida, Hisamitsu Yamamoto
Company: C. Uyemura & Co., Ltd.
Date Published: 9/22/2019 Conference: SMTA International
This selectivity makes subsequent electrolytic copper plating produce a low profile deposit on the rolled annealed (RA) copper foil that is free of any surface metallization deposit.
In contrast, when electroless copper is used for metallization, it is also deposited on the copper surface giving rise to a higher profile abnormal appearance of electrolytic copper plating.
Using this novel direct metallization technology, good coverage was obtained in via holes and through holes. In addition, high connection reliability between the inner copper layer and the electrolytic copper plating was attained, due to absence of any contaminants on the inner copper layer.
flex printed circuit boards, rigid-flex printed circuit boards, direct metallization technology, selective plating, formaldehyde free
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