SMTA International Conference Proceedings


Author: Mary Ann Nailos
Company: Process Sciences
Date Published: 9/12/1999   Conference: SMTA International

Abstract: This paper will briefly discuss the types of fluxes used in SMT processes in order to address the issue of residues that may be left on assemblies or components. The main types of residues encountered are ionic and non-ionic/organic. Each residue species can cause different types of problems, which will be identified and discussed.

Choosing the right test method will depend on identification of the residue type. Ionic residues can be quantified using an Ionic Contamination test saystem such as an OmegameterTM Quantification and identification is made using an Ion Chromatograph. A description of each piece of equipment and the advantages and disadvantages of each will be discussed. Organic residues are harder to identify and quantify. A number of test methods including FTIR, SEM/EDAX, Auger surface analysis and UV/VIS spectrophotometry will be discussed for both qualitative and quantitative analysis of these types of residues. At the end of the presentation the audience should have a better understanding of flux residues and the methods used for their detection and quantification.

Key words: Flux residues, contamination, Ion Chromatography, SEM/EDAX, FTIR, Auger.

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