Advanced PCB Lamination Material Development for High-Speed Networking ApplicationAuthors: Yuki Hirokawa, Tatsuya Arisawa, Shohei Hanazaki, Mitsuyoshi Nishino, Tomoyuki Abe
Company: Panasonic Corporation
Date Published: 9/22/2019 Conference: SMTA International
PCB material, Transmission loss, Low polarity resin, Low profile copper foil, Low Df glass cloth, Inner layer treatment, 5G, Wireless, RF, Millimeter wave
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