SMTA International Conference Proceedings


Advanced PCB Lamination Material Development for High-Speed Networking Application

Authors: Yuki Hirokawa, Tatsuya Arisawa, Shohei Hanazaki, Mitsuyoshi Nishino, Tomoyuki Abe
Company: Panasonic Corporation
Date Published: 9/22/2019   Conference: SMTA International


Abstract: This paper is an introduction of Advanced PCB Lamination Material Development for High-Speed Networking Application. We introduce our approach to improved electrical properties of new materials for future High Speed application.

Key Words: 

PCB material, Transmission loss, Low polarity resin, Low profile copper foil, Low Df glass cloth, Inner layer treatment, 5G, Wireless, RF, Millimeter wave



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