Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB ApplicationsAuthors: Ariel McFalls, Sam Rhodes, and Kunal Shah, Ph.D.
Date Published: 9/22/2019 Conference: SMTA International
An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency applications.
surface finish, ENIG, nickel-less technology, high reliability, robust solder joint, intermetallics
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