SMTA International Conference Proceedings


Handling Technical Cleanliness in Electronic Production

Authors: Michael Kövi, P.E. and Helmut Schweigart, Ph.D.
Company: Zestron
Date Published: 9/22/2019   Conference: SMTA International


Abstract: The challenges of technical cleanliness are propagated and driven by the automotive industry. In the past, drawings usually contained rather general information on component cleanliness, which were not verified systematically. Nowadays especially power components and camera systems as well as intelligent lighting systems are susceptible to particle contamination. Failures are scattering from thermal incidents to poor quality of light performance and others like:

  • electrical short circuit
  • shorter creepage and clearance distance
  • electrical insulation of contacts
  • impairment of optical systems such as cameras
  • reduced wettability/solderability
  • mechanical obstruction
  • increased or reduced friction
  • increased or reduced power
  • leaks

    Even disturbances in lighting systems are subject to lose customer reputation and thus business share in a highly competitive market. The manufacturability of a component as well as its performance have to be considered in this context, as it is the case when defining dimensional tolerances. Production processes, production environment and final packaging additionally influence component cleanliness. This often calls for agreements concerning compliance with limiting values between customer and supplier or product development and production. Particularly relevant in instances where limiting values are exceeded without necessarily impairing performance. A careful review is necessary to ensure that efforts complying with these values do not outweigh the potential risk, thereby avoiding excessive cleanliness requirements.

    Therefore, this paper will give an overview about the state of the art concerning handling technical cleanliness. It will provide details on latest developments in standardization, indications for an adopted approach on technical cleanliness, monitoring and validation procedures and eventually a brief introduction to risk assessment of particle contamination.

  • Key Words: 

    Technical cleanliness, particles, contamination, risk assessment



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