Ultra-Fine Solder Paste Dispensing for Heterogeneous Integration
Authors: Kenneth Thum, Sze Pei Lim, KC Tai Company: Indium Corporation and NSW Automation Sdn Bhd Date Published: 9/22/2019
Abstract: The industry is driving towards heterogeneous integration for advance packaging, with more dies and components packed into smaller footprints. There are some packaging designs where printing of solder paste is not possible and, therefore, dispensing can be an alternative way. Ultra-fine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. The objective of this study is to explore and demonstrate a solution for achieving consistent fine dot dispensing. This paper will discuss different dispensing equipment technologies and also important solder paste characteristics, and results will be presented in statistical method like Cpk, standard deviations, etc.
Ultra-fine dispensing, micro dispensing, Heterogeneous Integration, and SIP