SMTA International Conference Proceedings


Selective Solder Fine Pitch Components on High Thermal Mass Assembly

Author: Gerjan Diepstraten
Company: ITWEAE
Date Published: 9/22/2019   Conference: SMTA International


Abstract: The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.

Key Words: 

fine pitch, point-to-point, selective soldering, THT



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