Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection SystemsAuthors: Chrys Shea, Jennifer Fijalkowski, Raymond Whittier, Michael Butler, Edward Nauss, Dean Fiato
Company: Shea Engineering Services, BAE Systems, ITWEAE/MPM, StenTech
Date Published: 9/22/2019 Conference: SMTA International
The experiment was performed on the user’s assembly line using one set of printer and SPI equipment, and then replicated in the equipment supplier’s laboratory using a different printer and SPI gear. The results of each individual print test are discussed and then compared.
The experiment was then extended at the laboratory to include different solder pastes and show their response to different stencil designs, and potential for improving print capability of the assembly line.
stencil printing, nanocoating, miniaturization, SPI, solder paste
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.