Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment ReliabilityAuthors: Richard Coyle, Charmaine Johnson, Tim Pearson, Dave Hillman, Michael Meilunas, Fred Dimock, Richard Popowich, Bob Bouchard, Richard Parker, Keith Howell, Jörg Trodler, Arvind Karthikeyan, Elizabeth Barr
Company: Nokia Bell-Labs, Collins Aerospace, Universal Instruments, BTU International, iNEMI, Nihon Superior Co., Heraeus, Auburn University, Iowa State University
Date Published: 9/22/2019 Conference: SMTA International
Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
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