SMTA International Conference Proceedings

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability

Authors: Richard Coyle, Charmaine Johnson, Tim Pearson, Dave Hillman, Michael Meilunas, Fred Dimock, Richard Popowich, Bob Bouchard, Richard Parker, Keith Howell, Jörg Trodler, Arvind Karthikeyan, Elizabeth Barr
Company: Nokia Bell-Labs, Collins Aerospace, Universal Instruments, BTU International, iNEMI, Nihon Superior Co., Heraeus, Auburn University, Iowa State University
Date Published: 9/22/2019   Conference: SMTA International

Abstract: A daisy chained ball grid array test vehicle is used to compare the voiding and attachment reliability of convection assembly and vacuum assembly. Transmission x-ray inspection shows substantially lower void content with vacuum assembly. Accelerated thermal cycling (ATC) is used to assess the solder attachment reliability of the air and vacuum reflowed test vehicles. The thermal cycling results are discussed in terms of the better thermal fatigue performance with vacuum processing, the evolving industry standards for solder voiding, and suggestions for additional work.

Key Words: 

Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys

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