Reliability of the Solder Joints: Is a Shear Force a Good Indicator?Authors: Anna Lifton, Westin Bent, Irina Lazovskaya, Paul Salerno and Frank Andres
Company: Alpha Assembly Solutions
Date Published: 9/22/2019 Conference: SMTA International
The test vehicle used includes commonly used component sizes: 0603, 0805, and 1206 imperial chip components. Test vehicles were assembled using different reflow profiles with varying time above liquidus (TAL) and peak temperatures. Paste volumes were varied through stencil thickness and aperture reduction as an additional factor to this study. Solder joint strength was measured using XYZ Tech shear tester. The thermal cycle profile chosen was -40 ºC and +125 ºC with 10 and 20 minute dwell times. The thermal shock profile chosen was -40 ºC and +125 ºC with 3-minute dwell time. Solder joint strength was measured at selected intervals and microstructural characterization and intermetallic growth were monitored. The solder joint reliability data was correlated to thermal cycling type, dwell time, alloy composition and printed solder paste volume. This work seeks to provide basic guidelines and recommendations for specifying assembly and test parameters to ensure consistency across multiple data sets.
solder joint reliability, solder paste volume, shear strength, and solder joint inspection
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