SMTA International Conference Proceedings

Status of Pb-Free Risk Mitigation for Aerospace and Defense - An Attitude Adjustment Perspective

Author: Anthony J. Rafanelli
Company: Raytheon Company
Date Published: 9/22/2019   Conference: SMTA International

Abstract: NOTE: This document does not contain technology or technical data controlled under either the U.S. International Traffic in Arms Regulations or the U.S. Export Administration Regulations.

For close to thirty (30) years, the aerospace, defense, and high-performance (ADHP) industries have engaged in an unprecedented joint endeavor to familiarize themselves to Pb-free solder and finishes technology and develop strategies to address shortfalls, challenges, and otherwise risks associated with these materials when subjected into these industries’ respective service, environmental, and storage conditions. These efforts have resulted in thorough characterizations of the most widely used Pb-free materials leading to strategies and tools to execute risk mitigation as needed. Exercising “author’s privilege”, this paper will discuss several concepts significantly driving the focus of these industry efforts and the perceived positive results.

Key Words: 

Pb-free, lead-free, risk mitigation, aerospace/defense electronics

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819