SMTA International Conference Proceedings


Status of Pb-Free Risk Mitigation for Aerospace and Defense - An Attitude Adjustment Perspective

Author: Anthony J. Rafanelli
Company: Raytheon Company
Date Published: 9/22/2019   Conference: SMTA International


Abstract: NOTE: This document does not contain technology or technical data controlled under either the U.S. International Traffic in Arms Regulations or the U.S. Export Administration Regulations.

For close to thirty (30) years, the aerospace, defense, and high-performance (ADHP) industries have engaged in an unprecedented joint endeavor to familiarize themselves to Pb-free solder and finishes technology and develop strategies to address shortfalls, challenges, and otherwise risks associated with these materials when subjected into these industries’ respective service, environmental, and storage conditions. These efforts have resulted in thorough characterizations of the most widely used Pb-free materials leading to strategies and tools to execute risk mitigation as needed. Exercising “author’s privilege”, this paper will discuss several concepts significantly driving the focus of these industry efforts and the perceived positive results.

Key Words: 

Pb-free, lead-free, risk mitigation, aerospace/defense electronics



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