Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder AlloysAuthors: Richard Coyle, Charmaine Johnson, Dave Hillman, Richard Parker, Michael Osterman, Joe Smetana, Tim Pearson, Babak Arfaei, Keith Howell, Stuart Longgood, Andre Kleyner, Julie Silk, Andre Delhaise, Hongwen Zhang, Jie Geng, Ranjit Pandher, Eric Lundeen
Company: Nokia Bell Laboratories, Collins Aerospace, iNEMI, CALCE, Nokia, SUNY-Binghamton, Nihon Superior Co., Delphi Technologies, Aptiv, Keysight Technologies, Celestica, Indium Corp., Alpha Technologies, i3
Date Published: 9/22/2019 Conference: SMTA International
Pb-free alloys, high reliability solder alloys, ball grid array, thermal fatigue reliability, failure mode, solid solution strengthening
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