SMTA International Conference Proceedings

Micro-Computed Tomography Analysis for Failure Analysis in Electronics

Authors: Claire Brennan, Ph.D.
Company: Collins Aerospace
Date Published: 9/22/2019   Conference: SMTA International

Abstract: Failure analysis of electronic components is a complex discipline, involving a variety of analytical tools, including optical microscopy, electron microscopy and other techniques. X-ray radiography, both 2D X-ray and 3D computed tomography (CT), have been shown to be powerful techniques in diagnosing failure modes of surface mount electronic components as well as visualizing defects in the printed wiring boards themselves. In this paper, a few case studies involving 3D CT as a non-destructive failure analysis tool of electronics will be discussed. The case studies will include analysis and discussion of ball grid array (BGA) features, such as mixed metallurgy and void content as well as diagnosing printed wiring board assembly issues, such as handling issues and overall failure analysis.

Key Words: 

3D computed tomography, non-destructive analysis, printed wiring boards, ball grid arrays

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