Development of Low Temperature Sn-Bi Based Pb-Free Solder Alloys
Authors: Mehran Maalekian, Ph.D., Aranav Das, Ludo Krassenburg, Co van Veen, Ph.D., Alexander Kodentsov, Ph.D., Mo Biglari, Ph.D. Company: Mat-Tech Date Published: 9/22/2019
Abstract: Sn-Bi based alloys such as eutectic Sn-58Bi are standard lead-free solder alloys for mass application of low temperature soldering in electronic industry. This is mainly due to the low cost and low melting temperature (lower than eutectic Sn-Pb). The main drawback of this alloy is its poor ductility and formability which is due to the inherent brittleness of Bi. In order to improve the soldering, mechanical behavior and reliability of Sn-Bi based solders, lots of efforts have been made by incorporating alloying elements such as In, Ag, Cu and Sb into the alloy. The focus of this paper is to study the effect of In and Sb addition on the solderability and melting behavior of eutectic Sn-58Bi and off-eutectic Sn-40Bi.
Lead-free solder, low melting, wetting, contact angle, Sn-Bi, In, Sb