Analysis of the Root Cause for Solder Joint CrackingAuthors: Chaohui Hu, P.E., Weiming Li, P.E., Jianghua Shen, P.E.
Company: China CEPREI Laboratory
Date Published: 9/22/2019 Conference: SMTA International
The process of inserting for testing in the factory would cause great stress on IGBT solder joints, which could easily lead to micro-cracks in the solder joints. The simulation analysis confirmed that the position of IGBT pin was the stress concentration point under typical vibration conditions, and the stress fatigue crack continued to expand during the working process. IGBT device pins were heated by high current, and the increase of resistance caused by solder joint cracking further improves the heating power of solder joints and further promotes the fatigue cracking of solder joints. Under the coupling effect of vibration stress and thermal stress, cracks gradually penetrated through the solder joints, and ultimately lead to cracking failure of the solder joints.
solder joint, cracking, failure analysis
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