SMTA International Conference Proceedings


PCBA Cleanliness as a Means to Improve Humidity Robustness of Electronics

Authors: Rajan Ambat, Ph.D. and Kamila Piotrowska, Ph.D.
Company: Technical University of Denmark
Date Published: 9/22/2019   Conference: SMTA International


Abstract: During the past couple of decades, use of electronic systems have has increased in gigantic proportions. Use of power electronics in various sectors is a typical example as well as electrification of automotive. The device needs to be highly reliable for use in various climatic conditions. Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA surface under climatic exposure. PCBA cleanliness is a key factor determining the thickness and electrical property of water film formed under humidity exposure. Main factor determining the PCBA cleanliness is the use of no-clean flux systems for the wave and reflow soldering process. This paper provides a short overview on the PCBA cleanliness issue and connection to humidity robustness.

Key Words: 

solder flux, residues, climatic reliability, corrosion



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