Solder-Joint Reliability of BGA Packages in Automotive ApplicationsAuthors: Burton Carpenter, Andrew Mawer, Mollie Benson, John Arthur, Betty Yeung
Company: NXP Semiconductors, Inc.
Date Published: 9/22/2019 Conference: SMTA International
In all cases, the POR (plan of record) package BOM (bill of materials) and design configurations passed the application requirements. Per standard practice for solder-joint reliability studies, tests were extended past the application requirements until at least 75% of the population failed in order to construct Weibull plots and perform crack propagation analysis.
Multiple factors were observed to affect solder-joint reliability. Rules of thumb and high-level trends could be used for first order assessments only. For common body size, BGA pitch and solder alloy, no solder-joint lifetime dependence was observed for the different package types MAPBGA, TEPBGA and FCPBGA. The first solder-joints (die shadow vs. package edge) to fail were body size and die size dependent for wirebond packages. SnAg solderball alloy showed longer characteristic lifetime than the high Ag SAC alternatives SAC305, SAC405 and SAC387. Adding 3% Bi to the SAC solder alloy further increased lifetimes.
SAC, SnAg, Pb-free, Solder-joint reliability, temperature cycle, thermal fatigue, AATC, AATS, OSP, bismuth
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