Reliability Assessment of BGA Solder Joints - Megtron 6 Vs FR4 Printed Circuit BoardsAuthors: Mugdha Chaudhari, A S M Raufur R Chowdhury, Unique Rahangdale, Abel Misrak, Pavan Rajmane, Aniruddha Doiphode, Dereje Agonafer
Company: The University of Texas at Arlington
Date Published: 9/22/2019 Conference: SMTA International
In this work, we use Megtron 6 and FR4 circuit boards with BGA packages. A Dynamic Mechanical Analyzer (DMA) is used to obtain the time and temperature dependent viscoelastic properties of the boards while the Coefficient of Thermal Expansion (CTE) and glass transition temperatures are obtained from the Thermo-Mechanical Analyzer (TMA). The results obtained from characterization of both the boards are used to perform Finite Element Analysis (FEA). ANSYS is leveraged to study the life to failure of the package and its effect on the solder ball reliability using both the boards under different thermal loadings. We also compare the plastic work for these boards which play a significant role in the reliability of a package assembly.
Solder balls, ball grid array, printed circuit boards
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