Printed Circuit Board Design Can Impact Electrochemical ReliabilityAuthors: Mark McMeen and Mike Bixenman
Company: Magnalytix, LLC
Date Published: 9/22/2019 Conference: SMTA International
The study examines IPC 7093A Printed Board Design Considerations for Bottom Terminated Components. New BTC guidelines are being issued by IPC outlining critical design and process elements needed to assemble BTCs onto printed circuit board assemblies. A test vehicle was designed to examine SIR performance of two crucial BTC design points (a) open copper and (b) SMD thermal pads – spanning the range of IPC 7093 thermal pad options.
Decisions made during the bare board design phase can have a direct impact on the activity of the flux residue located under the bottom termination. The purpose of this study focuses on the design elements that improve flux outgassing. Past research finds that proper outgassing improves electrochemical reliability, especially when the device is exposed to atmospheric moisture.
Bottom Terminated Components, BTCs, QFN, BTC Electrochemical Reliability
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