High-Reliability Lead-Free Solder for Low-Cost Die Attach ApplicationsAuthors: Niveditha Nagarajan, Sathish Kumar, Gyan Dutt, Ranjit Pandher, Carl Bilgrien
Company: Macdermid Alpha Assembly Solutions
Date Published: 9/22/2019 Conference: SMTA International
This paper reports the results of tests done to compare the reflow characteristics, solderability and thermomechanical reliability of the new solder alloy with industry standards such as eutectic SnCu and SAC305. The first set of tests compares the performance of the solder alloys with respect to secondary reflow problems such as die tilt and voids. The second test involves inducing thermomechanical stress on LED packages that have been assembled onto aluminum and FR4 substrates, by thermal cycling for up to 1833 cycles. LED performance metrics such as junction temperature, luminous efficiency and color stability etc. were monitored. In addition, solder joint strength and microstructure evolution were recorded.
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