SMTA International Conference Proceedings


Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal Cycling

Authors: Tim Pearson, David Hillman, Ross Wilcoxon, Tim O'Neill, Karl Seelig
Company: Collins Aerospace and AIM Solder
Date Published: 9/22/2019   Conference: SMTA International


Abstract: The introduction of bottom terminated components (BTCs) was a product of surface mount technology (SMT) component style evolution. The low solder joint standoff height of BTC components has led to concern over their solder joint integrity within the IPC Class 3 electronics community. This paper documents an investigation to characterize the solder joint integrity of BTC components, using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification, for both tin/lead solder and lead-free solder alloys.

Key Words: 

Lead-free solder, Bottom Terminated Components (BTCs), Quad Flatpack No lead (QFN), Thermal Cycling



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