Real Time X-Ray Analysis of Void Formation and Dynamics in QFN Devices During ReflowAuthors: Sandeep Kullar, Christopher Rand, Evstatin Krastev
Company: Nordson Dage
Date Published: 9/22/2019 Conference: SMTA International
Common defects found within QFN devices include solder bridges, open connections and large solder voiding. Large solder voiding can occur if an unsuitable solder paste is applied, and/or if the thermal reflow profile being used is not optimized. Using conventional reflow ovens, it is not possible to examine void formation and their dynamics in real-time.
The goal of this study is to discuss a new X-ray technique that permits monitoring reflow process in real time and gain basic understanding of void formation dynamics for QFN devices utilizing several types of solder pastes. The equipment used is called X-ray Reflow Simulator. Basically, it is a small reflow oven that fits inside the X-ray machine to observe the reflow process in real time. It has the capability to follow pre-set heating and cooling profile to emulate the processes within the SMT oven.
X-ray inspection, X-ray Reflow Simulator, 2DX, MXI, AXI, Computer Tomography, CT, 2D, 3D, Quad Flat No-leads (QFN), BGA, SMT, PCBA, Voiding, X-ray
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