SMTA International Conference Proceedings

High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating

Author: Neil Hubble
Company: Akrometrix
Date Published: 9/22/2019   Conference: SMTA International

Abstract: Moisture exposure is a well-known variable that can affect surface mount package reliability. Moisture Sensitivity Level (MSL) guidelines are clearly established and frequently required for package storage and handling, under MSL levels 1-6, with the larger MSL numbers indicating higher moisture sensitivity and allowing for less moisture exposure. In more extreme cases moisture saturation can lead to internal separation of layers or delamination and “popcorning” effects on the sample surface.

The objective of this work is a case study showing the effects of moisture exposure on thermal warpage across reflow profile temperatures for a range of practical packaging applications. Multiple sample types and multiple samples of each type are studied to gather statistically significant data showing moisture’s effect on thermal warpage. Currently known and accepted MSL levels of specific packages will be studied to see if the extremes range of these MSL levels could result in different surface mount reliability due to increased warpage levels. Thermal warpage results will be compared to current industry standards for acceptable package warpage. The study will also look for any overall trends of moisture’s effect on warpage across the sample sets.

Key Words: 

warpage, moisture sensitivity, MSL, surface mount defects, J-STD-020E

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