High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) RatingAuthor: Neil Hubble
Date Published: 9/22/2019 Conference: SMTA International
The objective of this work is a case study showing the effects of moisture exposure on thermal warpage across reflow profile temperatures for a range of practical packaging applications. Multiple sample types and multiple samples of each type are studied to gather statistically significant data showing moisture’s effect on thermal warpage. Currently known and accepted MSL levels of specific packages will be studied to see if the extremes range of these MSL levels could result in different surface mount reliability due to increased warpage levels. Thermal warpage results will be compared to current industry standards for acceptable package warpage. The study will also look for any overall trends of moisture’s effect on warpage across the sample sets.
warpage, moisture sensitivity, MSL, surface mount defects, J-STD-020E
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