Bare Board Design Research to Improve Flux Outgassing under BTCsAuthors: Mike Bixenman, David Lober, and Mark McMeen
Company: KYZEN Corporation and STI Corporation
Date Published: 6/5/2018 Conference: ICSR (Soldering and Reliability)
The purpose of this paper is to research bare board design features for placement of the QFN component. The test board design has four quadrants. Design features such as solder mask definition can be different across the four quadrants. The test board has sensors placed at the pin and thermal lug regions to study the activity of flux residues and cleaning effects. The test methods will include component specific SIR followed by IC. The data findings, inferences and best practices for building reliable assemblies will be reported.
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