ICSR (Soldering and Reliability) Conference Proceedings


Isothermal Aging Effects of Doped Lead-Free Solder Performance in Super BGA Package

Authors: Anto Raj, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D.
Company: Auburn University
Date Published: 6/5/2018   Conference: ICSR (Soldering and Reliability)


Abstract: This paper discusses the aging effects for evaluating doped lead-free solder alloy performance in different solder pastes for high reliability products using survival analysis. The temperature shock test experimental failure results are from 31 mm Super Ball Grid Array components. In this experiment, doped and SAC 305 solder balls with Bi, Ni and Sb doped solder pastes are studied. This test result gives an indication of material combinations that are a potential solution to the traditional material degradation problem of SAC 305 solder alloys. The results discuss the effects of different paste dopant materials and their impact on reliability of surface mount components. The test substrates have a thickness of 1.5748mm, made up of FR4 substrate with a glass transition temperature of 170°C. This experiment investigates the performance of solder joints in temperature liquid shock before and after 6 months of aging at 125°C.

Key Words: 

Lead-free, BGA, SBGA, Thermal shock



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