ICSR (Soldering and Reliability) Conference Proceedings

Development of Novel Activators for Use in Halogen Free and Water Soluble Solder Pastes

Authors: Julia Del Re, Ph.D., Mitra Matloobi, Ph.D., and Mehran Maalekian, Ph.D.
Company: AIM Solder
Date Published: 6/5/2018   Conference: ICSR (Soldering and Reliability)

Abstract: RoHS and REACH environmental regulations have had a significant impact on the materials used in PCB assembly with the solder and soldering processes being profoundly affected. The elimination of lead (Pb) and restrictions on halides/halogens used in fluxes have proven to be some of the more difficult challenges to overcome. In this paper we explore a potential new class of activators which offer improved performance versus traditional activator systems in terms of paste processing, soldering performance and reliability. In order to demonstrate the versatility of these activators we study their use in both no clean and water soluble pastes and compare them to pastes containing traditional activators. It is demonstrated that these activators improve the activity of the paste without creating other issues such as corrosion.

Key Words: 

activator, voiding, lead-free, weak organic acid

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