ICSR (Soldering and Reliability) Conference Proceedings


Development of Low Flux Splattering Solder Paste for Sensor and Camera Module Applications

Authors: Jasbir Bath, Shantanu Joshi, Noriyoshi Uchida
Company: Koki Solder
Date Published: 6/5/2018   Conference: ICSR (Soldering and Reliability)


Abstract: With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for ADAS (Advanced Driver Assistance System) and Internet Of Things (IoT) applications there is a demand for no-clean flux formulations in lead-free solder paste which can reduce flux splattering during reflow.

Development was done on a specially adopted flux chemistry which helped to reduce solder/flux spattering without the use of a specially developed reflow profile adjustment in an air reflow atmosphere. The flux chemistry in the Sn3Ag0.5Cu solder paste was developed so that the flux residue layer can cover the molten solder surface during reflow preventing splattering. Tests were done on a copper plate printed with solder paste and a copper plate placed slightly above the reflowing solder paste on the test vehicle to measure flux splattering with variety of reflow profiles evaluated. While the conventional solder pastes required an increase of pre-heat temperature to drive off volatile flux components to reduce splattering, the developed paste successfully prevented occurrence of the splatter regardless of the type of preheat and reflow profile used. The results of the work will be reported.

Key Words: 

Flux Splattering. Reflow, Printing, Voiding



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