2D and 3D (CT) X-Ray Inspection Advances for Void Analysis in ElectronicsAuthor: David Bernard
Company: David Bernard Consultancy
Date Published: 6/5/2018 Conference: ICSR (Soldering and Reliability)
X-ray inspection has long been used to non-destructively probe for these issues, both in R&D and in production. This often enables the root cause of issues to be quickly investigated without the need to cut or destroy the sample, an act which may otherwise potentially mask the real situation. The presence, quantity and location of voids can be clearly seen and measured in the X-ray results. This paper will explain the recent developments that have been made in 2D, 2.5D and 3D X-ray inspection and how they can be applied to electronics. The developments to be discussed will include the use of limited angle computer tomography (CT), sometimes also called laminography, as well as the use of new ‘full CT’ algorithms, such as helical CT, which improve the clarity of the necessary analysis and clearly locate the source of potential voiding and joint / interfacial problems. IGBTs will be used as an example of how these techniques are needed to provide the necessary analysis to clearly locate the source of potential voiding problems.
X-ray, CT, PCT, Void, Helical, Inspection
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