How Does Surface Finish Affect Solder Paste Performance?Author: Tony Lentz
Company: FCT Assembly
Date Published: 10/14/2018 Conference: SMTA International
In this work, several different surface finishes were tested in the surface mount process including: HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver. Several different types of solder pastes were tested along with each surface finish including: lead-free no-clean and water-soluble, and leaded no-clean and water-soluble solder pastes. Each combination of surface finish and solder paste were evaluated for print performance, wetting, solder balling, graping, and voiding. The results of this testing were quantified and summarized. Recommendations pairing the optimal solder paste with each surface finish were given.
surface finish, solder paste, solder paste printing, wetting, solder balling, graping, voiding
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