SMTA International Conference Proceedings


Influence of Bonding Parameters on Reliability of CU Wire-Bonding to Electroless Ni/Pd/Au Plating

Authors: Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa
Company: Hitachi Chemical Co., Ltd.
Date Published: 10/14/2018   Conference: SMTA International


Abstract: We investigated the influence of bonding parameters on the Cu wire-bonding reliability of electroless Ni/Pd/Au. We obtained excellent Cu wire-bonding reliability at optimized bonding parameters (bonding force, ultrasonic power, scrub (circle) number (or number of scrubbing), and scrub (sliding) distance) without over-pressing of the capillary to the plating film. We concluded that the primary factor in the excellent Cu wire-bonding reliability was moderately compressive deformation of the Au-plating film without stack of Au film to the capillary. The compressive deformation of the Cu wire and Au-plating film by scrubbing is necessary to obtain a strong bonding at the Cu-Au interface.

Key Words: 

Electroless Ni/Pd/Au, Cu Wire-bonding, Bonding Parameters, Scrub



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