SMTA International Conference Proceedings

Effects of ENIG Nickel Corrosion on Wetting Balance Test Results and Intermetallic Formation

Authors: Donald Gudeczauskas, George Milad
Company: Uyemura International Corporation
Date Published: 10/14/2018   Conference: SMTA International

Abstract: Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.

Key Words: 

ENIG, corrosion, intermetallic formation, solder wetting balance

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