Strain Energy Model for UnderfillAuthors: Michael Bodendorfer, Reza Ghaffarian
Company: Jet Propulsion Laboratory, California Institute of Technology
Date Published: 10/14/2018 Conference: SMTA International
A new strain energy model based on adhesive material for bond/underfill was developed to estimate the mean-time-to-failure (MTTF) under accelerated thermal cycle testing. To reduce the complexity of analysis, the strain-energy model concentrated on the assumption that the test data generated under laboratory accelerated thermal cycle condition is need to be projected for an application cycle condition. The paper presents details of this energy model approach and provides an example for an adhesive that its characteristics behavior with temperature was derived from dynamic mechanical analysis (DMA) plots.
underfill, adhesive bond, potting, strain energy, solder joint reliability, thermal cycle, DMA
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.