Rework Practices for Microleds and Other Highly Miniaturized SMT Components
Authors: Neil O'Brien, Robert Avila Company: Finetech Date Published: 10/14/2018
Abstract: Miniaturization of SMT components has been a continuing trend in all marketplaces, but probably most notable in consumer electronics. Smartphones and the rapid advances in the display market have implemented various microLED’s, as well as small passive devices such as 01005 and 008004 devices. Packing more miniature devices into less space, results in very challenging rework conditions. Repairing these sites should not create more rework by damaging neighboring components or the substrate. The use of glue and foil shields are not reliable high-yield methods. This challenge requires novel solutions for tooling, site preparation, paste deposition, precise thermal management, as well as high accuracy and optical resolution. This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components. For the general purposes of this paper, miniaturized components are those below 1mm in length and width.